Defects in Silicon III, W.M. Bullis, W. Lin,
P. Wagner, T. Abe and S. Kobayashi. PV 99-1, Seattle, Washington, Spring 1999, $64.00 member - $77.00
nonmember. Current state-of-the-art defects in silicon are detailed in this proceedings
volume. As integrated circuits become more dense, crystalline and other defects
in silicon wafers have a greater effect on the properties of the circuits. Bulk
and surface defects, both grown-in and process-induced are considered.
Process Physics and Modeling in Semiconductor Technology (5th
International Symposium), C.S. Murthy, G.R. Srinivasan and S.T. Dunham. PV 99-2, Seattle,
Washington, Spring 1999, $45.00 member - $54.00 nonmember. This proceedings includes research activities, in the form of review articles
and contributed papers, related to modeling and simulation of processes in
semiconductor technology. It represents both a growing synergism and a forum for
semiconductor process physicists, modelers, and technologists. Selected
contributions focus on understanding the relevant phenomena which includes ion
implantation, diffusion, and processes such as surface/interfacial, nucleation
and growth.
Silicon-on-Insulator
Technology and Devices IX, P.L.F. Hemment, S. Cristoloveanu, T.W.
Houston, K. Izumi and H. Hovel. PV 99-3, Seattle, Washington, Spring 1999,
$65.00 member - $78.00 nonmember. Highlighting this volume are reports of new and exciting advances in SOI device
processing and manufacturing technologies. After three decades of research and
development it now appears that SOI circuits will enter the commercial market.
Papers focus on the challenges of manufacturing SOI circuits for volume
production of high performance/low power applications.
State-of-the-Art Program on Compund Semiconductors XXX, C.R. Abernathy,
A. Baca, D.N. Buckley, K.H. Chen, R. Kopf, and R.E. Sah. PV 99-4, Seattle,
Washington, Spring 1999, $52.00 member - $62.00 nonmember. The most recent advances in compound semiconductors are addressed. Topics
include materials growth, characterization processing, device fabrication and
reliability, nanofabrication, contact formation, passivation, packaging,
non-destructive testing, wireless technologies, and novel materials.
New Directions in Electroanalytical Chemistry II, J. Leddy, M.D. Porter,
and P. Vanysek. PV 99-5, Seattle, Washington, Spring 1999, $52.00 member -
$62.00 nonmember. This symposium was a forum to present the newest methods and technologies of
electroanalytical chemistry. These proceedings cover discussions of instruments,
methods, unusual media, materials and environments, spectroscopy, microscopy,
separations, detection, data processing, and modeling.
Silicon
Nitride and Silicon Dioxide Thin Insulating Films (5th International Symposium),
K.B. Sundaram, M.J. Deen, W.D. Brown, R.E. Sah, E. Poindexter, D. Misra. PV
99-6, Seattle, Washington, Spring 1999, $47.00 member - $56.00 nonmember. Topics include: film preparation; film and film/substrate interface analyzing
novel techniques; passivation charge transport and trapping; tunneling phenomena
and dielectric breakdown; defects and impurities; electrical, chemical,
physical, and optical properties; multilayer dielectric layers, stacks, and
interfaces; plasma processing; and rapid thermal process of oxidation
nitridation isolation techniques and radiation effects.
Low and High
Dielectric Constant Materials: Materials Science, Processing and Reliability
Issues (4th) and Thin Film Materials for Advanced Packing Technologies (2nd),
R. Singh, H.S. Rathore, R. Thakur, S.S. Ang, M.J. Loboda and R.K. Ulrich. PV
99-7, Seattle, Washington, Spring 1999, $54.00 member - $64.00 nonmember. This combined volume contains papers from two symposia. The first section of the
volume emphasizes all aspects of low and high dielectric materials in silicon
and compound semiconductor circuits and devices. In addition to materials
issues, special emphasis is given to process integration and manufacturability.
The second section covers all aspects of thin film materials and processes used
in advanced interconnection and packaging technologies for semiconductor
devices.
Environmental Issues in the Electronics and Semiconductor Industries (2nd
International Symposium), L. Mendicino and L. Simpson. PV 99-8, Seattle,
Washington, Spring 1999, $43.00 member - $52.00 nonmember. The increasing public awareness of environmental issues, such as global warming,
ozone depletion, and toxic pollutants, has had a profound effect on the process
technologies used for electronic component manufacturing. The electronics and
semiconductor industries have been exploring new chemistries and processes, as
well as abatement and waste treatment technologies, to achieve more
environmentally benign processes. The discussions of all of these issues are
covered in this volume.
Electrochemical
Processing in ULSI Fabrication and Semiconductor/Metal Deposition II,
P.C. Andricacos, P.C. Searson, C. Reidsema-Simpson, P. Allongue, J.L. Stickney,
and G.M. Oleszek. PV 99-9, Seattle, Washington, Spring 1999, $62.00 member -
$74.00 nonmember. Developments in the rapidly evolving chip-interconnect technology, where
electrochemical processes play a significant role, are discussed. The
convergence of academic research in this and other areas of metal/semiconductor
deposition with technology requirements, as posed by the electronics and other
industries, is a requirement for the continued success of electrochemical
processes and is a focal point of this volume.
Advances in
Rapid Thermal Processing, F. Roozeboom, J.C. Gelpey, M.C. Ozturk, J.
Nakos. PV 99-10, Seattle, Washington, Spring 1999, $62.00 member - $74.00
nonmember. Recent innovations in RTP equipment issues are covered in this volume, as well
as processes and applications in the fabrication of advanced semiconductor and
other devices. Topics include: ultra-thin gate dielectrics and MOS gate stacks;
ultra-shallow junctions and contacts; epitaxial growth; equipment issues; and
new applications of RTP.
Photovoltaics for the 21st Century, V.K. Kapur, R.D. McConnell, D.
Carlson, G.P. Ceasar and A. Rohatgi. PV 99-11, Seattle, Washington, Spring 1999,
$39.00 member - $47.00 nonmember. Recent scientific and technical developments made in photovoltaic (PV)
technology have helped lower the cost of PV modules and the price of PV systems.
PV technology is thus making an entry into a variety of commercial markets, and
is likely to make significant contributions, globally, to the power generation
industry. The papers in this volume cover such topics as: new devices and
structures, device modeling, new materials and synthesis, optical designs,
hybrid systems, and environmental issues.
Fullerenes
Vol. 7: Recent Advances in the Chemistry and Physics of Fullerenes and Related
Materials (Twelfth International Symposium), K.M. Kadish, P.V. Kamat,
and D.M. Guldi. PV 99-12, Seattle, Washington, Spring 1999, $95.00 member -
$114.00 nonmember. Topics include all aspects of fullerenes science and technology, with
subsections on: electrochemistry, metallofullerenes, ESR, photoexcited states,
gas phase/mass spectrometry, extraction/purification, theory, organic
functionalization, technology/polymers, organometallics/structural,
biochemical/pharmaceutical, surface/film studies, thermodynamics, diffraction
studies and structural and solid-state physics, nonotubes/nanocarbons, and
fullerene-based superconductors.
Solid-State Ionic Devices, E.D. Wachsman, M.-L. Liu, J.R. Akridge and N.
Yamazoe. PV 99-13, Seattle, Washington, Spring 1999, $65.00 member - $78.00
nonmember. Solid-state electrochemical devices are becoming pervasive in our
technologically driven lifestyles. A fundamental understanding of ionic
transport and interfacial phenomena in ceramics is imperative to a wide variety
of these devices, from solid oxide fuel cells and ceramic membranes to
solid-state sensors and battery electrodes. This proceedings describes current
advances in ion conducting ceramics and the design, fabrication, and performance
of devices that utilize them.
Tutorials in Electrochemical Engineering-Mathematical Modeling, R.F.
Savinell, A.C. West, J.M. Fenton, and J. Weidner. PV 99-14, Seattle, Washington,
Spring 1999, $39.00 member - $47.00 nonmember. Modeling and simulation are important tools for developing an understanding of
electrochemical processes and phenomena. The uses of these techniques often
accelerate optimization and implementation of technology, as well as reduce
development costs. This volume includes tutorial papers on mathematical
techniques, solution algorithms, and approaches in simulating electrochemical
phenomena and processes. All scales are addressed, including molecular,
microscopic, macroscopic, and system levels.
Spectroscopic Tools for Analysis of Electrochemical Systems, F. Argoul,
J. McBreen, D.A. Scherson, and A. Wieckowski. PV 99-15, Seattle, Washington,
Spring 1999, $48.00 member - $58.00 nonmember. This volume provides an interdisciplinary look at the application of
spectroscopic methods for study of electrochemical interfacial phenomena. Topics
of interest include in situ spectroscopies and scanning probe microscopies,
e.g., FTIR, Raman, ellipsometry, AFM, STM, NMR; and synchrotron-based
techniques, such as surface diffraction and X-ray absorption fine structure (EXFAS);
and ex situ electron-based spectroscopies such as Auger electron, X-ray photo
electron, and electron (ion) scattering. Of particular interest are
illustrations of the use of these methods to the study of well-ordered systems,
e.g., adsorbates and deposits on single-crystal surfaces, nonostructures,
intermetallics, self-organizing systems, islands and defects. Theoretical
aspects of interfacial systems are also discussed.
Anayltical and Diagnostic Techniques for Semiconductor Materials, Devices,
and Processes. B.O. Kolbesen, C. Claeys, P. Stallhofer, F. Tardif, J. L.
Benton, P. Rai-Choudhury, T. J. Shaffner, D. K. Shroder, and M. Tajima. PV
99-16, Honolulu, Hawaii, Fall 1999, $62.00 member - $75.00 nonmember. This combined volume contains materials from two symposia. The first section
covers activities in the field of analytics and characterization of
semiconductor materials and processes. Topics include: bulk impurities, defects,
and stress; surface and thin films; and materials and process characterization
and monitoring. The second section covers new techniques, as well as advances in
routine analytical technology applied to semiconductor process development and
manufacturing. Issues related to state-of-the-art IC production, such as time
and cost measurements, measurement-induced device damage, technique
modifications needed for submicron characterization, comparisons of techniques,
optimum combinations of metrology, defect and yield correlation, and measurement
needs for next generation manufacturing are discussed.
State-of-the-Art Program on Compound Semcionductors XXXI. D. N. Buckley,
S. N. G. Chu, and F. Ren. PV 99-17, Honolulu, Hawaii, Fall 1999, $54.00 member -
$65.00 nonmember. Recent advances in compound semiconductor technologies are detailed. Topics
discussed include: materials growth, characterization, processing, device
fabrication, and reliability.
ULSI Process Integration. G. Bronner, C. L. Claeys, R. B. Fair. PV 99-18,
Honolulu, Hawaii, Fall 1999, $54.00 member - $65.00 nonmember. ULSI Process Integration reviews and discusses all aspects of process
integration. In addition to full technologies and future trends, both front- and
back-end integration issues are presented.
Solid Oxide
Fuel Cells. M. Dokiya, and S. C. Singhal. PV 99-19, Honolulu, Hawaii,
Fall 1999, $82.00 member - $98.00 nonmember. Highlights include: recent developments related to solid oxide fuel cells based
on zirconia or another oxide electrolyte; materials for cell components;
fabrication methods for cell components and complete cells; cell design,
electrochemical performance and modeling; stack and systems including studies;
and field tests.
Carbonate Fuel Cell Technology V. K. Hemmes, G. Lindbergh, J. R. Selman,
D. A. Shores, and I. Uchida. PV 99-20, Honolulu, Hawaii, Fall 1999, $58.00
member - $70.00 nonmember. This comprehensive volume presents information on the status of molten carbonate
fuel cell technology, various aspects of its commercialization, recent advances
in MCFC technology, and results of MCFC related fundamental research. The focus
is on cascaded generation systems, high power density performance, performance
stability in 20,000h+ operation, and novel materials.
Chlori Alkali and Chlorate Technology: R. B. MacMullin Memorial Symposium.
H. S. Burney, N. Furuya, F. Hine, and K. Ohta. PV 99-21, Honolulu, Hawaii, Fall
1999, $52.00 member - $62.00 nonmember. Dedicated to the late R. B. MacMullin, this volume is devoted to a wide spectrum
of research, development, engineering, business, and historical aspects of chlor-alkali
and chlorate technology. Dr. MacMullin was a pioneer in industrial
electrochemical engineering and an active member of The Electrochemical Society
for over 60 years. He contributed considerably to the field of design and
optimization of chlor-alkali electrolytic cells. Topics discussed include:
advances in production methods; fundamental studies of process changes, cell
design, performance optimization, energy reductions, or plant design; and
improved technology, equipment, or materials.
Advanced Luminescent Materials and Quantum Confinement. S. Bandyopadhyay,
M. Cahay, N. Koshida, J. P. Leburton, D. J. Lockwood, M. Meyyappan, and T.
Sakamoto. PV 99-22, Honolulu, Hawaii, Fall 1999, $70.00 member - $84.00
nonmember. Adressing recent developments in the area on nanoscale semiconductor, metallic,
and organic structures, this volume emphasizes quantum effects and single
electron storage in small-scale silicon and III-V compound devices. This text
also covers fundamental issues in Luminescence Physics and Chemistry of new
classes of phosphor and porus materials including both atomic and molecular
structures.
Chemical Sensors IV. M. Aizawa, M. A. Butler, P. Vanysek, and N. Yamazoe.
PV 99-23, Honolulu, Hawaii, Fall 1999, $78.00 member - $94.00 nonmember. All aspects of chemical sensor research and development are addressed in this
volume. Concentrating on the transduction from chemical species to physical
effect, as well as sensor arrays, sensor systems and associated signal
processing, and applications of chemical sensors. Also covered are mass and
electron transfer, and interfacial and homogeneous kinetics.
Intercalation
Compounds for Battery Materials. G. A. Nazri, T. Ohzuku, and M.
Thackeray. PV 99-24, Honolulu, Hawaii, Fall 1999, $87.00 member - $104.00
nonmember. This volume provides the latest innovations in electrode materials for advanced
batteries. The physics and chemistry of intercalation compounds is emphasized
along with the fundamentals of electrode materials design and optimization.
Topics include: fundamental aspects of redox process and charge transfer in
intercalation materials; synthesis, characterization, and materials engineering;
electrochemical properties and cell performance characteristics; structure and
reaction mechanism; chemical and electrochemical, and structural stability as a
function of state of charge; electronic and magnetic properties of intercalation
systems; and molecular simulation of intercalation compounds and theoretical
modeling of electrochemical processes.
Lithium Batteries. R. A. Marsh, Z. Ogumi, J. Prakash, and S. Surampudi.
PV 99-25, Honolulu, Hawaii, Fall 1999, $90.00 member - $108.00 nonmember. Fundamental and applied aspects of primary lithium batteries (liquid and solid
cathode) and secondary lithium batteries (lithium metal, lithium ion and lithium
metal polymer, lithium ion polymer) are covered. Topics include: anode
materials, cathode materials, electrolytes, separators, cell reaction
mechanistic studies, overcharge/over discharge protection studies, novel
electrode processing/cell manufacturing methods, performance and safety
characteristics of cells and batteries, failure modes/mechanisms, and
cell/battery modeling studies.
Corrosion and
Corrosion Control in Saltwater Environments. P. M. Natishan, S. Ito, D.
A. Shifler, and T. Tsuru. PV 99-26, Honolulu, Hawaii, Fall 1999, $52.00 member -
$62.00 nonmember. Addressing recent corrosion research in marine and other saltwater environments,
this volume contains papers detailing both basic and applied research areas that
advance the understanding of corrosion. Specific topics include: corrosion
processes, mechanisms, corrosion sensor and detection techniques, and
environmentally compliant methods of corrosion prevention or control in ocean
and brackish waters.
Passivity and
Localized Corrosion: International Symposium in Honor of Professor Norio Sato.
R. G. Kelly, B. MacDougall, M. Seo, and H. Takahashi. PV 99-27, Honolulu,
Hawaii, Fall 1999, $78.00 member - $94.00 nonmember. The latest advances in passivity and localized corrosion are covered in this
volume. Topics include: structure, composition, and thickness of passive films;
optical, electronic, ionic, and mechanical properties of passive films; growth
and breakdown processes of passive films, and repassivation process; noise
analysis of precursor processes of localized corrosion; statistical and
stochastic analyses of localized corrosion; kinetics, stability, and morphology
of corrosion pits; and transport processes within pits and crevices.
Localized In
Situ Methods for Investigating Electrochemical Interfaces. A. C.
Hillier, M. Seo, and S. R. Taylor. PV 99-28, Honolulu, Hawaii, Fall 1999, $55.00
member - $66.00 nonmember. Physical and chemical heterogeneities within electrode surfaces play a critical
role in governing the behavior of local electrochemical processes. These
processes range from corrosion and electrocrystallization to electrocatalysis
and membrane-based separations. The ability to monitor and spatially resolve
these local, dynamic electrochemical processes in situ will provide a new means
to understand their origin and nature. This symposium is the first on this
subject and introduces the most recent experimental and theoretical advances in
scanning probe techniques and spatially resolved characterization.
Corrosion and Reliability of Electronic Materials and Devices. R. B.
Comizzoli, R. P. Frankenthal, and J. D. Sinclair. PV 99-29, Honolulu, Hawaii,
Fall 1999, $52.00 member - $62.00 nonmember. Discussion on corrosion and other materials degradation processes that affect
the reliability of electronic and optoelectronic devices and equipment are
included. This volume also details studies of the mechanisms of degradation and
failure and the effects of manufacturing processes and environmental conditions.
Various intrinsic degradation processes are also discussed, including effects of
diffusion, electromigration, and mechanical stress. Methods for evaluating
devices and materials and for hardening them are also included.
Plasma
Etching for Sub-Quarter Micron Devices. D. W. Hess, Y. Horiike, and G.S.
Mathad. PV 99-30, Honolulu, Hawaii, Fall 1999, $64.00 member - $77.00 nonmember.
Fundamental and applied aspects of plasma etching processes for the fabrication
of quarter and sub-quarter micron semiconductor devices are covered. Topics
include: novel plasma sources and reactor designs, process and reactor modeling,
high plasma density processes for thin film etching, plasma diagnostics and
process control, and modeling of issues relating to plasma device damage.
Interconnect
and Contact Metallization for ULSI. Y. Arita, G.S. Mathad, and H.R.
Rathore. PV 99-31, Honolulu, Hawaii, Fall 1999, $58.00 member - $70.00
nonmember. Papers focus on all aspects of materials, process, equipment and reliability of
multilevel interconnections in sub 0.25 (m semiconductor devices and circuits
for ULSI technologies. Focus areas include: copper as conductor material and its
processes, low-k dielectric materials and processes, and reliability issues.
Diamond Materials VI. J. C. Angus, W. D. Brown, and A. Gicquel. PV 99-32,
Honolulu, Hawaii, Fall 1999, $70.00 member - $84.00 nonmember. Papers describing the latest developments in diamond and related materials from
around the world have been gathered for this volume. It includes continuing
coverage of the emerging field of electrochemistry of diamond materials, with
papers about electrosynthesis on diamond materials, diamond electrodes for
sensors, and electrochemical characterization of diamond electrodes. Other
topics include: growth, characterization, properties, and applications of
diamond materials.
Fundamental of Electrochemical Deposition and Dissolution. D. Landolt, M.
Matlosz, and Y. Sato. PV 99-33, Honolulu, Hawaii, Fall 1999, $75.00 member -
$90.00 nonmember. Aspects of electrochemical deposition and dissolution processes, including
structure and properties of electrochemically deposited metals, alloys,
semiconductors, conducting polymers, metal oxides, and superconductors are
detailed in this volume. Specific topics include: nucleation and growth,
kinetics and mechanisms, structure and physical properties, mathematical
modeling and numerical analysis of deposition and dissolution processes, and
processing and tooling aspects of micro-engineered structures.
Electrochemical
Technology Applications in Electronics III. C. Madore, T. Osaka, L. T.
Romankiw, and Y. Yamazaki. PV 99-34, Honolulu, Hawaii, Fall 1999, $70.00 member
- $84.00 nonmember. Topics presented are related to theory and practice of electrochemistry and
electrochemical engineering as applied in the electronics industry to
fabrication, operation, and protection of electronic devices, and components,
including computers, storage products, office machines, consumer products,
telephony, wireless communication, photography, MEMS, and automotive
applications.
Semiconductor Wafer Bonding: Science, Technology, and Applications V. C.
E. Hunt, H. Baumgart, T. Abe, and U. Goesele. PV 99-35, Honolulu, Hawaii, Fall
1999, $79.00 member - $95.00 nonmember. Bonding of whole wafer semiconductors is examined. Different techniques include
fusion, anodic, eutectic, thermal, and UHV bonding. Surface science of bonding,
both theory and experimental, as well as applications to SOI, microstructures,
sensors, photonics, and power electronics are demonstrated. Considerable
emphasis is given to expanding the applicability of wafer bonding to greater
usage, both electronic and non-electronic.
Cleaning
Technology in Semiconductor Device Manufacturing VI. T. Hattori, R. E.
Novak and J. Ruzyllo. PV 99-36, Honolulu, Hawaii, Fall 1999, $85.00 member -
$102.00 nonmember. Papers contained in this volume cover a broad range of topics related to the
cleaning of silicon surfaces in advanced semiconductor manufacturing. In
particular, various aspects of surface contaminants in silicon processing, dry
and wet cleaning chemistries, as well as silicon surface termination are
considered. Moreover, application specific cleaning methods, post-CMP cleaning
technology, and cleaning in integrated processes are discussed.
Chemical
Mechanical Polishing in IC Device Manufacturing III. Y. A. Arimoto, R.
L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and Y. Homma. PV 99-37,
Honolulu, Hawaii, Fall 1999, $76.00 member - $91.00 nonmember. This proceedings volume addresses the fundamentals of chemical mechanical
planarization (CMP) and its application in Inter Layer Dielectrics (ILD)
polishing, metal polishing, and trench and mesa isolation. Also addressed are:
post-CMP cleaning, consumable characterization, polish end point detection, CMP
process integration, and maufacturability issues with this emerging technology.
High Temerature Corrosion and Materials Chemistry: Per Kofstad Memorial
Symposium. P. Y. Hou, T. Maruyama, M. J. McNallan, T. Narita, E. J. Opila,
and D. A. Shores. PV 99-38, Honolulu, Hawaii, Fall 1999, $79.00 member - $95.00
nonmember. This volume is dedicated to the memory of Per Kofstad, a leader in the fields of
high temperature corrosion and oxide defect chemistry. This volume focuses on
defect chemistry of metal oxides pertaining to oxidation reactions, diffusion
and transport-related phenomena in oxidation and corrosion reactions,
hot-corrosion phenomena, effects of hydrogen and water vapor on oxidation and
corrosion mechanisms, and vaporization phenomena.
Environmental Aspects
of Electrochemical Technology. K. Ota and E. J. Rudd. PV 99-39,
Honolulu, Hawaii, Fall 1999, $54.00 member - $65.00 nonmember. There is a growing concern regarding the environment and the need to conserve
materials and resources. This volume contains the results of ongoing research
and development programs that address this concern, including pollution
prevention, process optimization, and the recovery and re-use of chemicals and
materials.
Physics and
Chemistry of Luminescent Materials. C. R. Ronda, K. C. Mishra, L. Shea,
A. Srivastava and H. Yamamoto.PV 99-40, Honolulu, Hawaii, Fall 1999, $62.00
member - $74.00 nonmember. Various aspects of luminescence are covered in this volume including both
inorganic and organic solids. Specific topics covered include: luminescent
materials for lamp applications, display and VUV phosphors, electroluminescent
phosphors, multiphoton processes, and laser materials.
Molten Salts
XII. H. C. De Long, S. Deki, G. R. Stafford, and P. C. Trulove. PV
99-41, Honolulu, Hawaii, Fall 1999, $82.00 member - $98.00 nonmember. Technology opportunities related to molten salt technologies are reviewed in
this volume. Topics include: electrochemical power, homogeneous reactions,
electrodeposition, separations, molten salt promoted corrosion phenomena, solute
and solvent structural investigations, and new innovative molten salt mixtures.
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