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Past ECS Short Courses

 


2014

Spring — 225th ECS Meeting, Orlando, FL

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2013

Fall — 224th ECS Meeting, San Francisco, CA
Spring — 223rd ECS Meeting, Toronto, ON, Canada

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2012

Fall — PRiME 2012, Honolulu, HI
Spring — 221st ECS Meeting, Seattle, WA

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2011

Fall — 220th ECS Meeting, Boston, MA
Spring — 219th ECS Meeting, Montreal, Canada, CA

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2010

Fall — 218th ECS Meeting, Las Vegas, NV
Spring — 217th ECS Meeting, Vancouver, Canada

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2009

Fall — 216th ECS Meeting, Vienna, Austria
Spring — 215th ECS Meeting, San Francisco, CA

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2008

Fall — PRiME 2008, Honolulu, Hawaii
Spring — 213th ECS Meeting, Phoenix, AZ

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2007

Fall
Spring

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2006

Fall
Spring

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2005

Fall
  • Fundamentals of Atomic Force Microscopy for Electrochemical Applications
    K. Jones (Asylum Research)
  • Basics of Impedance Spectroscopy
    P. Agarwal (Fideris Test Solutions) and M. Orazem (University of Florida)
  • Basics of Cleaning Processes for Integrated Circuit Manufacturing
    K. Reinhardt, (Cameo Consulting), J. Butterbaugh (FSI International), J. Farber (Lam Research Corporation), and R. Small (EKC Technology)
  • Electrical Characterization and Characteristics of
    MOS Devices with Ultrathin (0.5-1.5 nm) High-K Gate Dielectrics

    S. Kar (India Institute of Technology)
  • Electroplating for ULSI and Microelectronic Circuitry: Theory and Applications
    T. Dinan and R. Contolini (Electrolytics)
  • Nanomaterials for Nanotechnology
    ZLWang (Georgia Institute of Technology)
  • Solid State Lighting
    A. Srivastava (General Electric Global Research) and
    I. Ferguson (Georgia Institute of Technology)
  • PEM Fuel Cells
    H. Gasteiger (General Motors) and E. Stuve (University of Washington)
  • Battery Design and Simulation
    R. Spotnitz (Battery Design LLC)
Spring
  • Electrochemical Nanotechnology
    S. Lipka (U. of Kentucky)
  • Impedance Spectroscopy: Theory and Applications
    M. E. Orazem (U. of Florida)
  • SOFC Fuel Cells
    A. Virkar (U. of Utah) and S. Adler (U. of Washington)

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2004

Fall
  • Battery Design and Simulation
    R. Spotnitz (Battery Design Company)
  • Electrochemical Nanotechnology
    S. Lipka (U. of Kentucky)
  • Fundamentals and Applications of Electrochemical Capacitors
    B. Conway (U. of Ottawa) and J. Miller (JME)
  • Impedance Spectroscopy: Theory and Applications
    M. E. Orazem (U. of Florida)
  • Integration of Copper Metallization and Low-k
    Dielectrics for ULSI Interconnects and Its Reliability

    H. Rathore (IBM) and D. B. Nguyen (IBM)
Spring
  • Battery Design and Simulation
    R. Spotnitz (Battery Design Company)

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2003

Fall
  • Basics of Cleaning Processes for Integrated
    Circuit Manufacturing, K. Reinhardt (NOVELLUS)

    J. Butterbaugh (FSI International), J. Farber (Lam Research Corporation), and R. Small (EKC Technology)
  • Battery Design and Simulation
    R. Spotnitz (Battery Design Company)
  • Impedance Spectroscopy: Theory and Applications
    M. E. Orazem (U. of Florida)
  • Principles of PEM Fuel Cell Engineering-I:
    Water Management and Flow Field Plate Design

    E. Stuve (U. of Washington)
Spring
  • Fundamentals and Applications of Electrochemical Capacitors
    B. Conway and J. Miller
  • Impedance Spectroscopy: Theory and Applications
    M. E. Orazem (U. of Florida)

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2002

Fall
  • Battery Design and Simulation
    R. Spotnitz (Battery Design Company)
  • Lithium Ion Batteries
    Thomas B. Reddy (Rutgers University) and K. M. Abraham (E-KEM Sciences)
  • Principles of PEM Fuel Cell Engineering-I:
    Water Management and Flow Field Plate Design

    Eric M. Stuve (U. of Washington)
Spring
  • Plasma Processing of Low-K Dielectric Films
    D. W. Hess
  • Fundamentals and Applications of Electrochemical Capacitors
    B. Conway and J. Miller
  • Impedance Spectroscopy: Theory and Applications
    M. E. Orazem (U. of Florida)

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2001

Fall
  • Impedance Spectroscopy
    M. E. Orazem
  • Battery Design and Simulation
    R. Spotnitz
  • Chemical Mechanical Polishing
    K. B. Sundaram
  • PEM Fuel Cells
    T. Zawodzinski
Spring
  • Integrated Circuit Fabrication and Yield Control
    E. Levine
  • Plasma Processing of Low-K Dielectric Films
    D. W. Hess

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2000

Fall
  • Battery Failure Analysis
    S. C. Levy
  • Microfabrication Techniques
    P. J. Hesketh and D. Babic
  • Electrochemistry in Medical Research
    B. E. Conway and R. Eberhardt
  • Luminescence and Luminescent Materials
    C. Ronda, A. Meijerink, J. McKittrick, and A. Srivastava
  • Chemical Mechanical Planarization: Fundamentals and Practice
    V. Desai, A. Dogariu, K. Richardson, S. Seal, K. Sundaram, and W. Easter
Spring
  • Impedance Spectroscopy
    M. E. Orazem

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1999

Fall
  • Chemical Analysis with Microsensors and Microsystems
    A. J. Ricco and D. J. Harrison
  • The Integration of Copper Metallization and
    Low k-Dielectrics for ULSI Interconnects, and Its Reliability
    H. S. Rathore and D. B. Nguyen
  • Lithium Ion and Lithium Polymer Batteries
    B. Scrosati, S. C. Levy, and T. Osaka
  • Plasma Processing for 180 nm Devices
    D. E. Ibbotson and D. W. Hess
  • Simulation of Nanoscale Materials and Devices
    P. A. von Allmen and J.-P. Leburton
Spring
  • 21st Century Tools for Acceleration of Technological Innovation
    J. P. Dismukes and J. R. Susko

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1998

Fall
  • Simulation of Nanoscale Materials and Devices
    P. von Allmon and J.-P. Leburton
  • Processes, Materials, and Electrochemical
    Characterization of Thin Film Transistors

    Y. Kuo, M. Hack, and D. Ast
  • Fundamentals of Microfabrication Techniques
    P. J. Hesketh and D. Babic
Spring
  • Copper Metallization for Sub-Micron Integrated Circuit Technology
    H. S. Rathore and D. Nguyen
  • Microelectronic Packaging Technology
    S. S. Ang
  • Semiconductor Metrology
    K. B. Sundaram and V. H. Desai

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1997

Fall
  • Electromagnetic Compliance and Interference (EMC & EMI/RFI) and
    Electrostatic Discharge (ESD): Materials Reliability and Corrosion Issues

    R. Haynes and R. P. Frankenthal
  • Lithium Ion Battery Technology
    S. C. Levy and B. Scrosati
  • Introduction to Systems Design, Integration and Testing for Device Engineers
    V. Swaminathan
Spring
  • Electromagnetic Compliance and Interference (EMC & EMI/RFI) and
    Electrostatic Discharge (ESD): Materials Reliability and Corrosion Issues

    R. Haynes and R. P. Frankenthal
  • Fundamentals and Applications of Electrochemical Capacitors
    B. E. Conway and J. Miller
  • Simulation of Nanoscale Materials and Devices
    P. von Allmen and J.-P. Leburton

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1996

Fall
  • Processes, Materials, and Electrical Properties of Thin Film Transistors
    Y. Kuo, M. Hack, and D. G. Ast
  • Battery Failure Analysis
    S. C. Levy
  • Electrochemical and Controlled Environment Scanning Probe Microscopy
    S. Lindsay, K. Sieradzki, D. Yaniv, N. Tao, S. Pfeiffer, and M. Flowers
Spring
  • Multichip Module Packaging Technology
    S. S. Ang

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For additional information about Education, please contact: education @electrochem.org

 
 

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