Call for Papers
The ECS Journal of Solid State Science and Technology is publishing a focus issue on IEDMS 2021, the 26th International Electron Devices & Materials Symposium sponsored by The Electronics Devices and Materials Association and National Cheng Kung University, which was held November 18-19, 2021.
The IEDMS conference provides an annual platform for international scientists, engineers, and researchers to present the latest research results, ideas, developments, and applications in electron devices and materials. The themes of this conference cover fields for materials and devices including compound semiconductors, novel materials, nano and 2D materials, Si-based process, photonics, and sensors. Original high-quality papers related to these themes are welcomed, including theories, design, modeling, simulation, reliability, fabrication, integration, and applications in electronic relative fields.
Papers covering the following topics are sought:
- Compound semiconductor materials and devices;
- Novel materials including 2D, nanotubes, nanosheet based materials and related applications;
- Si-based processing, devices and Integration including Si, SiC, SiGe, Ge-based technology;
- Photonic materials/devices;
- Novel device concepts and applications such as flexible electronics;
- Integrated solid state sensors for physical, chemical, and biomedical detection;
- Device simulation and modeling.
This virtual focus issue is open to everyone. Interested authors may submit review, critical review, perspective, methods, or original research articles.
Accepting Submissions: January 20, 2022 | Submission Deadline: April 20, 2022
(At the time of submission, indicate that the paper is intended for the Focus Issue on Selected Papers from the International Electron Devices and Materials Symposium 2021 [IEDMS 2021])
Guest Editors
Wei-Chou Hsu, National Cheng Kung University, Taiwan | wchsu@eembox.ee.ncku.edu.tw
Yon-Hua Tzeng, National Cheng Kung University, Taiwan | tzengyo@mail.ncku.edu.tw
Shoou-Jinn Chang, National Cheng Kung University, Taiwan | changsj@mail.ncku.edu.tw
Meng-Hsueh Chiang, National Cheng Kung University, Taiwan | mhchiang@mail.ncku.edu.tw
Sheng-Po Chang, National Cheng Kung University, Taiwan | changsp@mail.ncku.edu.tw
Technical Editor
Fan Ren, University of Florida, U.S. | fren@che.ufl.edu
Editor-in-Chief
Krishnan Rajeshwar, The University of Texas at Arlington, U.S. | rajeshwar@uta.edu
Articles are published in a standard issue of the journal as they are accepted. If selected at submission, accepted papers are published online in the ECS Digital Library on IOPscience within 24 hours of scheduling for publication. The version of record is published online within approximately 10 days of final acceptance.
Visit the ECS website for author submission instructions and requirements for each article type.
OPEN ACCESS: Authors choosing to publish open access agree to pay an article processing charge (APC) if their papers are accepted. APCs are discounted by 75 percent for ECS members and waived for authors from ECS Plus subscribing institutions. Check if your institution subscribes to ECS Plus. Discounts are applied at the time of payment.
