Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #7

Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #6

Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #5

Symposium D06: Surface Characterization and Manipulation for Electronic Applications

Symposium Focus: The properties of interfaces underpin many of the advances and emerging applications in electronics. From studies of charge transport in molecular electronics to interactions between biomolecules in bioelectronics sensing, the ability to understand and control interfacial properties is more important than ever. This symposium aims to address interfacial properties in a variety of electronic applications, where the functionalization of interfaces is demonstrated and characterized in order to advance understanding and to enable new devices and device applications.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #4

Symposium A07: Battery Safety and Failure Modes

Symposium Focus: Long life, high power, reliable and safe lithium-ion batteries are needed for new consumer electronics, vehicle and grid storage applications. Demands for increased battery functionality, makes the severity of a potential battery safety incident a growing risk for emerging lithium-ion battery technologies. The objective of this symposium is to address lithium-ion battery durability, reliability and safety from a materials and cell design perspective with the goal of reducing the severity of an energetic safety incident. Better understanding of battery failure modes and effects could enable cell and system design improvements, performance enhancements and facilitate regulatory approvals of advanced lithium-ion battery power systems.

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Top 6 reasons to attend the next ECS meeting

ECS biannual meetings are a forum for sharing the latest scientific and technical developments in electrochemistry and solid state science and technology. Scientists, engineers and industry leaders come from around the world to attend the technical symposia, poster sessions, and professional development workshops. Not to mention exciting networking opportunities and social events.

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Exhibit and sponsor deadline March 9!

Don’t miss the opportunity to sponsor or exhibit at our largest spring meeting ever! Join us as ECS heads to the Seattle Sheraton and Washington State Convention Center in Seattle, WA from May 13-17, 2018, for the 233rd ECS Meeting. This is a can’t miss event for electrochemists and solid state scientists, featuring over 2,600 abstracts in over 50 symposia.

In addition to long running symposia on batteries, semiconductors, fuel cells, fullerenes, and luminescent materials, the Seattle meeting will also explore newer areas such as materials recycling, data science for modeling and design, consumer products, and flexible electronics.

This meeting is the perfect opportunity to get your products and services in front of our specialized audience of leading scientist and engineers!

Reserve a booth or browse our sponsorship options
Return applications by Friday, March 9, 2018

If your organization is interested in exhibiting or sponsoring, please contact Ashley Moran, ECS corporate programs manager, via email.

Building on the success of the first ECS Data Sciences Hack Day at the 232nd ECS Meeting this past October 2017, ECS is pleased to offer another opportunity at the 233rd ECS Meeting in Seattle this May.

ECS Data Sciences Hack Week is the Society’s foray into building an electrochemical data sciences and open source community from the ground up. Dataset sharing and open source software have transformed many “big science” areas such as astronomy, particle physics, synchrotron science, protein and genomic sciences, as well as computational sciences. The goal of this event is to increase awareness and impact of data science tools, open source software, and shared datasets in electrochemistry by bringing together people from different backgrounds to collaborate.

Data science tools and approaches have the potential to transform bench science like electrochemistry. The critical need is to build a community of electrochemical data scientists, the people who will contribute to a growing library of shared experimental and computational datasets, and who develop and adapt open source software tools.

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Why attend?

Consider ECS the prologue to your success story. As the must-attend event for academic and industry professionals from across the globe, it introduces you to the electrochemical and solid state science and technology trends, insights, and players who can help you make major strides in your career.

ECS meetings offer five days of learning, technical presentations, business development and networking opportunities for scientists, engineers and industry leaders from more than 70 countries. With a wide range of technical sessions, social events and hands-on courses, ECS meetings are the best investment you can make in your career.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #3

Symposium A02: Challenges in Novel Electrolytes, Organic Materials, and Innovative Chemistries for Batteries – in Honor of Michel Armand

Symposium Focus: On polymer electrolytes, ionic liquid electrolytes, new electrolyte salts, conductive layer-coated electrode materials, electrode materials for organic batteries, metal/electrolyte interfaces, fuel cells made with previous materials and/or electrolytes, anode metal based rechargeable batteries, and any innovative cell design and chemistry.

Both theoretical and experimental papers are accepted, and contributions from industry and students are encouraged.

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Yamagata University

The First International Conference on 4D Materials and Systems (4DMS), sponsored by ECS, will be held in Yonezawa, Yamagata, Japan from August 26-30, 2018 at the Faculty of Engineering, Yamagata University, Yonezawa, Japan.

This international conference will bring together engineers, medical professionals, clinicians, chemists, biologists, and physicists under the same roof to initiate roadmap, share results, and discuss issues related to the latest advancements in the fundamental science and technological developments in challenges and innovations in polymer gels and network materials, including; electrochemical materials and devices for energy conversion and storage; smart engineering materials, robotics, soft-smart robotics; material processing – theoretical and experimental approach; and printed and flexible electronics.

This conference will have five parallel tracks:

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