Topic Close-up #8

Symposium:

H04—Gallium Nitride and Silicon Carbide Power Technologies 13

Extended abstract deadline:
April 21, 2023

For additional information on 244th ECS Meeting symposia, consult more topic close-ups.

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Topic Close-up #7

Symposium: A04—Next Generation Batteries

Extended abstract deadline:
April 21, 2023

For additional information on symposia offered at the 244th Meeting, review more topic close-ups.

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NanotechnologyTopic Close-up #6

Symposium: L07—Nanoscale Electrochemistry

Extended abstract deadline:
April 21, 2023

For additional information on symposia offered at the 243rd Meeting read more topic close-ups.

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Register for May 30 workshop

If you are attending the 243rd ECS Meeting in Boston, join us for our second Peer Review Excellence Workshop on Tuesday, May 30, 2023, from 0830-1100h ET. This is an optional free session for registered meeting attendees. Space is very limited, so register early to confirm your seat!

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244th ECS Meeting: Sensors Topics

Get a “sense” of what’s going on in the sensors field! Check out our list of symposia on sensors and related topics taking place at the 244th ECS Meeting from October 8-12, 2023, in Gothenburg, Sweden. We “detect” you’ll like what you see. Submit your abstract and join us!

Submit your abstract

Extended abstract deadline: April 21, 2023

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Interested in high-temperature energy, materials, and processes? Check out our list of symposia on that and related topics taking place at the 244th ECS Meeting in Gothenburg, Sweden. Join us!

Submit your abstract

Extended abstract deadline: April 21, 2023

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NetworkTopic Close-up #5

Symposium:Z03—Young Researchers in Europe: A Special Symposium and Workshop

Extended abstract deadline:
April 21, 2023

 

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Topic Close-up #4

Symposium: J01—Luminescence and displays materials: fundamental and applications

Extended abstract deadline:
April 21, 2023

 

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Topic Close-up #2

Symposium: H02—Semiconductor Wafer Bonding: Science, Technology and Applications 17

Extended abstract deadline:
April 21, 2023

 

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Topic Close-up #1

Symposium D03—Advanced 3D Interconnect Technologies and Packaging

Extended abstract deadline:
April 21, 2023

 

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