The call for abstracts for the 228th ECS Meeting to be held Oct. 11-16, 2015 in Phoenix, AZ is now open.

Meeting abstracts should explicitly state objectives, new results, and conclusions or significance of the work.

Regardless of whether you submit as a poster or an oral presentation, it is at the symposium organizers’ discretion whether it is scheduled for an oral or poster presentation.

Technical programming for this meeting will be determined in June 2015.

Abstracts are due no later than May 1, 2015.

Find out more.

The editors of the Journal of The Electrochemical Society (JES) and the ECS Journal of Solid State Science and Technology (JSS) are calling for papers for these upcoming focus issues:

JES Focus Issues:

Electrochemical Interfaces in Energy Storage Systems
Submission Deadline: June 1, 2015
Focusing on a better understanding of the mechanism of electronic and ionic transport phenomena across electrode-electrolyte interfaces and solid-state interphases in electrochemical energy storage systems. READ MORE.

Redox Flow Batteries – Reversible Fuel Cells
Submission Deadline: August 1, 2015
Focusing on integration of renewable energy sources, like wind and solar into the electrical grid system and how that poses major challenges due to their variable nature and unpredictable availability. READ MORE.

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The ECS Journal of Solid State Science and Technology (JSS) is one of the newest peer-reviewed journals from ECS launched in 2012.

Atomic Layer Etch (ALEt) and Atomic Layer Clean (ALC) are emerging as enabling technologies for sub 10nm technology nodes. At these scales performance will be extremely sensitive to process variation.

Atomic layer processes are the most promising path to deliver the precision needed. However, many areas of ALEt and ALC are in need of improved fundamental understanding and process development. This focus issue will cover state-of-the-art efforts that address a variety of approaches to ALEt and ALC.

Topics of interest include but are not limited to:

• Surface reaction chemistry and its impact on selectivity
• Plasma ion energy distribution and control methods
• Novel plasma sources and potential application to ALEt & ALC
• Innovative approaches to atomic layer material removal
• Novel device applications of ALEt & ALC
• Process chamber design considerations
• Advanced delivery of chemicals to processing chambers
• Metrology and control of ALEt & ALC
• Device performance impact
• Synthesis of new chemistries for ALEt & ALC application
• Damage free surface defect removal
• Process and discharge modeling

Find out more!

Deadline for submission of manuscripts is December 17, 2014.

Please submit manuscripts here.

The ECS Journal of Solid State Science and Technology (JSS) is one of the newest peer-reviewed journals from ECS launched in 2012.

Printing technologies in an atmospheric environment offer the potential for low-cost and materials-efficient alternatives for manufacturing electronics and energy devices such as luminescent displays, thin film transistors, sensors, thin film photovoltaics, fuel cells, capacitors, and batteries.

This focus issue will cover state-of-the-art efforts that address a variety of approaches to printable functional materials and devices.

Topics of interest include but are not limited to:

• Printable functional materials: metals; organic conductors; organic and inorganic semiconductors; and more
• Functional printed devices: RFID tags and antenna; thin film transistors; solar cells; and more
• Advances in printing and conversion processes: ink chemistry; ink rheology; printing and drying process; and more
• Advances in conventional and emerging printing techniques: inkjet printing; aerosol printing; flexographic printing; and more

Find out more!

Deadline for submission of manuscripts is November 30, 2014.

Please submit manuscripts here.

The ECS Conference on Electrochemical Energy Conversion & Storage with SOFC–XIV

The ECS Conference on Electrochemical Energy Conversion & Storage with SOFC–XIV is an international conference convening in Glasgow, Scotland, July 26-31, 2015. It is devoted to all aspects of research, development, and engineering of solid oxide fuel cells, batteries, and low-temperature fuel cells, electrolyzers, and redox flow cells.

This international conference will bring together scientists and engineers to discuss both fundamental advances and engineering innovations.

See the Call for Papers for detailed information about the symposia, manuscript submission requirements, and financial assistance.

Submit your abstract here.

Be a sponsor or exhibitor.

The ECS Journal of Solid State Science and Technology (JSS) is one of the newest peer-reviewed journals from ECS launched in 2012.

Atomic Layer Etch (ALEt) and Atomic Layer Clean (ALC) are emerging as enabling technologies for sub 10nm technology nodes. At these scales performance will be extremely sensitive to process variation.

Atomic layer processes are the most promising path to deliver the precision needed. However, many areas of ALEt and ALC are in need of improved fundamental understanding and process development. This focus issue will cover state-of-the-art efforts that address a variety of approaches to ALE and ALC.

Topics of interest include but are not limited to:

• Surface reaction chemistry and its impact on selectivity
• Plasma ion energy distribution and control methods
• Novel plasma sources and potential application to ALEt & ALC
• Innovative approaches to atomic layer material removal
• Novel device applications of ALEt & ALC
• Process chamber design considerations
• Advanced delivery of chemicals to processing chambers
• Metrology and control of ALEt & ALC
• Device performance impact
• Synthesis of new chemistries for ALEt & ALC application
• Damage free surface defect removal
• Process and discharge modeling

Find out more.

Plan now to participate at CSTIC 2015, one of the largest and the most comprehensive annual semiconductor technology conferences in China.

We invite you to submit your papers now for the China Semiconductor Technology International Conference 2015, one of the largest and the most comprehensive annual semiconductor technology conferences in China. CSTIC is organized by SEMI and IEEE, co-organized by China’s High-Tech Expert Committee (CHTEC). It is co-sponsored by ECS, MRS and China Electronics Materials Industry Association. CSTIC 2015 will be held on March 15-16, 2015 at the SHICC, Shanghai, China, in conjunction with SEMICON China 2015. It will cover all the aspects of semiconductor technology and manufacturing, including devices, design, lithography, integration, materials, processes, manufacturing as well as emerging semiconductor technologies and silicon material applications. Hot topics, such as 3D integration, III-V semiconductors, carbon nanoelectronics, LEDs, and MEMS. And CPTIC 2015 has joined CSTIC 2015 as Symposium XII : Si Materials and Photovoltaic Technology.

We are soliciting papers from authors around the world on all aspects of semiconductor and photovoltaic technology and manufacturing, including semiconductor design, Frond-End-of-Line (FEOL), Back-End-of-Line (BEOL), packaging, testing, as well as emerging semiconductor technologies; photovoltaic market, policy, power grid, device, design, process, tooling, materials, and fundamental study between China and the rest of the world with a focus on industrial applications.

Submit your abstract online.

The 227th ECS Meeting is in Chicago, IL from May 24 – 28, 2015

The call for abstracts for the 227th ECS Meeting to be held May 24-28, 2015 in Chicago, IL is now open.

Meeting abstracts should explicitly state objectives, new results, and conclusions or significance of the work.

Regardless of whether you submit as a poster or an
oral presentation, it is at the symposium organizers’ discretion whether it is scheduled for an oral or poster presentation.

Programming for this meeting will occur in January 2015.

Abstracts are due no later than November 14, 2014.

Find out more.

This focus issue will cover state-of-the-art efforts that address a variety of approaches to printable functional materials and devices.

Printing technologies in an atmospheric environment offer the potential for low-cost and materials-efficient alternatives for manufacturing electronics and energy devices such as luminescent displays, thin film transistors, sensors, thin film photovoltaics, fuel cells, capacitors, and batteries.

Significant progress has been made in the area of printable functional organic and inorganic materials including conductors, semiconductors, dielectric, and luminescent materials

These will enable exciting advances in printed electronics and energy devices. Some examples are printed amorphous oxide semiconductors, organic conductors and semiconductors, inorganic semiconductor nanomaterials, silicon, chalcogenide semiconductors, ceramics, metals, intercalation compounds, and carbon-based materials.

This focus issue will cover state-of-the-art efforts that address a variety of approaches to printable functional materials and device. The focus issue will include both invited and contributed papers reflecting recent achievements. Prospective authors are encouraged to submit contributions reporting the original research results or reviewing key emerging trends in printable functional materials and devices for publication in this focus issue.

Find out more.

Workshop on Defects in Wide Band Gap Semiconductors
September 23, 2014
University of Maryland, College Park

Call for abstracts.

CALL FOR ABSTRACTS

Abstracts accepted in the following categories:

GALLIUM NITRIDE AND SILICON CARBIDE AND RELATED COMPOUNDS

• Origin of defects in wide band-gap semiconductors
• Extended defects in wide band-gap semiconductors
• Defect reduction strategies
• Atomic level control of material growth
• Growth optimization and growth yield
• Defect dynamics in extreme environments

WIDE BANDGAP POWER DEVICES

• Defect-device performance-reliability correlations
• Defect-manufacturing yield correlations
• Role of defects in wide bandgap power electronics
• Defect modeling and defect-device performance models
• Defect characterization, in-situ and in real time
• Advanced defect characterization in both ground and excited states
• Defect modeling in ground and excited states
• Manufacturing yield and cost reduction strategies

Instructions and submission template.

DEADLINE JULY 28