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Fall is here and with the changing of the leaves comes the arrival of Interface. As we are still affected by the impact of the global COVID-19 pandemic, we decided to publish the fall 2020 issue of Interface in a digital format only. As a member of the Society, I’m thrilled to give you a first glimpse into our most recent issue. Published today, it focuses on a very timely topic, Electrochemistry for a Sustainable World, guest edited by Paul Kenis.

Peer Review Week 2020 is underway. This yearly global event celebrates the essential role that peer review plays in maintaining scientific quality. This year’s theme, Trust in Peer Review, centers on how the peer review process works and why it helps build trust in scholarly research.

Join the global conversation about peer review by tweeting @PeerRevWeek and following #PeerRevWeek20 and #TrustinPeerReview.

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Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium that took place during PRiME 2020.

Submissions are open to all authors working in this field, including authors who presented during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)

IOPscience is IOP Publishing (IOPP)’s online publishing platform, and host of ECS content since the beginning of 2020. Users experiencing issues in downloading ECS content from IOPscience should first check that they are using an IOPP preferred browser. IOPP now only works with browsers which receive regular security updates from Microsoft, for example Edge, Chrome, Firefox, and Safari. Internet Explorer (IE) is not an IOPP preferred browser because it is no longer supported by Microsoft and does not receive regular security updates. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Future of Intercalation Chemistry for Energy Storage and Conversion in Honor of M. Stanley Whittingham

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Intercalation Chemistry for Electrochemical Energy Storage Technologies: In Honor of M. Stanley Whittingham Symposium taking place during PRiME 2020. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Recent Advances in Chemical and Biological Sensors & Micro-Nanofabricated Sensors and Systems

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Sensors Symposia (M01, M02 & M03) taking place during PRiME 2020.

This focus issue highlights recent advances in the field of chemical sensors (gas, liquid, and other types), including molecular recognition surfaces, transduction methods, and integrated micro-nano-sensor systems.

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