Topic Close-up #6
Symposium D02: Dielectrics for Nanosystems 9: Materials Science, Processing, Reliability, and Manufacturing
Extended Deadline for Submitting Abstracts:
December 17, 2021
Symposium focus: Advanced semiconductor products that are true representatives of nanoelectronics have reached below 12 nm. Depending on the application, the nanosystem may consist of one or more of the following types of functional components: electronic, optical, magnetic, mechanical, biological, chemical, energy sources, and various types of sensing devices. As long as one or more of these functional devices is in 1-100 nm dimensions, the resultant system can be defined as nanosystem. Papers are solicited in all areas of dielectric issues in nanosystems including gate dielectric materials for Si, SiC, SiGe, Ge, Ferroelectric, Neuromorphic, and devices for AI hardware; dielectric materials for devices based on nanowires, nanotubes, and grapheme; 2D Semiconductors and dielectric materials for high temperature and energy savings and harvesting applications; and dielectric materials for sensing devices. In addition to traditional areas of semiconductor processing, novel topological insulators are of interest, which may lead to new applications of nanosystems. A special session on data driven dielectrics is planned. Recently data driven materials science is of great interest because it opens a door to discover new innovative materials. This method can be applied to dielectric materials. In this session, we demonstrate the workflow for new dielectrics and showcase the discovery process. First a database is prepared by automatic calculation.
Virtual screening is done by machine learning using the database. Then, high throughput real screening is done so candidates find new dielectric materials.
More than 15 invited speakers from academia, national laboratories, and industries have already confirmed their participation. Additional invited talks may be selected from among the submitted abstracts.
Check the Call for Papers for more details.