Deadline for Submitting Abstracts
March 30, 2018
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Topic Close-up #11

Symposium E04: Electrodeposition of Reactive Metals and Alloys for Energy Storage

Symposium purpose is to bring together experts from the fields of electrodeposition and energy storage to discuss and learn about the science and technological issues in this fascinating topic which we share. Electrodeposition or plating of reactive compounds is common place in energy storage applications such as metal-air, lithium metal and next generation sodium, magnesium or calcium battery concepts. On the other hand, high quality coatings of reactive metals and alloys such as aluminum, magnesium, vanadium and zinc find applications in anti-corrosion coatings, microelectronics, fuel cells, electrolyzers, supercapacitors and sensors. We welcome all abstracts about novel deposition processes, electrolytes and additives, insights in kinetics, nucleation and growth phenomena, as well as on advanced applications in this field.

Confirmed Invited Speakers include Dr. Fanny Barde of Toyota Motor Europe, Dr. Debra R. Rolison of NRL, Prof. Craig B. Arnold from Princeton University, Prof. Takayuki Homma from Waseda University and Snehashis Choudhury, young investigator at Cornell University (group of prof. Lynden Archer).

Deadline for Submitting Abstracts
March 30, 2018
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Topic Close-up #10

Symposium G02: Atomic Layer Deposition Applications 14

Symposium Focus: This symposium focuses on a variety of applications of ALD and other atomic layer-by-layer processing in semiconductor CMOS (e.g. high-k oxides and metals for memories like Flash and 3D NAND, MIM, MIS capacitors), photovoltaics, energy storage and conversion, catalysis, optics and photonics, smart coatings of nanoporous materials, MLD and hybrid ALD/MLD, fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory, new precursors and delivery systems, optical and photonic applications, productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition, spatial ALD, area-selective ALD, Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #9

Symposium G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8

Symposium Focus: This meeting is the 8th International ECS SiGe Symposium for the past 16 years (www.sigesymposium.com). It will provide a forum for people from industry, research institutions, and academics around the world to gather together in an unique and relaxed environment, reviewing and discussing materials and device related aspects of SiGe, Ge, and Related Compounds (Group IV incl. C and Sn alloys, and III/V on Si, as well as 2D materials). There are 10 areas of interests covering very broad spectrum from devices to fundamental material characterization, to stimulate information exchange and innovations, 1) Heterojunction Bipolar Transistors, 2) FET Technology, 3) Optoelectronics, 4) Epitaxy, 5) Emerging Applications, 6) Processing, 7) Strain Engineering, 8) Surfaces and Interfaces, 9) Related Compounds, 10) Metrology and Characterization.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #8

Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15

Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.

Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.

Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #7

Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #6

Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #5

Symposium D06: Surface Characterization and Manipulation for Electronic Applications

Symposium Focus: The properties of interfaces underpin many of the advances and emerging applications in electronics. From studies of charge transport in molecular electronics to interactions between biomolecules in bioelectronics sensing, the ability to understand and control interfacial properties is more important than ever. This symposium aims to address interfacial properties in a variety of electronic applications, where the functionalization of interfaces is demonstrated and characterized in order to advance understanding and to enable new devices and device applications.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #4

Symposium A07: Battery Safety and Failure Modes

Symposium Focus: Long life, high power, reliable and safe lithium-ion batteries are needed for new consumer electronics, vehicle and grid storage applications. Demands for increased battery functionality, makes the severity of a potential battery safety incident a growing risk for emerging lithium-ion battery technologies. The objective of this symposium is to address lithium-ion battery durability, reliability and safety from a materials and cell design perspective with the goal of reducing the severity of an energetic safety incident. Better understanding of battery failure modes and effects could enable cell and system design improvements, performance enhancements and facilitate regulatory approvals of advanced lithium-ion battery power systems.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #3

Symposium A02: Challenges in Novel Electrolytes, Organic Materials, and Innovative Chemistries for Batteries – in Honor of Michel Armand

Symposium Focus: On polymer electrolytes, ionic liquid electrolytes, new electrolyte salts, conductive layer-coated electrode materials, electrode materials for organic batteries, metal/electrolyte interfaces, fuel cells made with previous materials and/or electrolytes, anode metal based rechargeable batteries, and any innovative cell design and chemistry.

Both theoretical and experimental papers are accepted, and contributions from industry and students are encouraged.

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Deadline for Submitting Abstracts
March 16, 2018
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Topic Close-up #2

Symposium C02: Pits & Pores 8: Nanomaterials – Fabrication, Properties, and Applications

Symposium Focus: This symposium is aimed at the fabrication of all kinds of porous structures, their physical and chemical properties as well as their applications. It is a continuous attempt to integrate the diverse research in different fields such as localized metal corrosion, semiconductor electrochemistry, pore-filling, matrix materials, optical spectroscopy and characterization of magnetic properties in order to develop a highly transdisciplinary approach to the topic. Emphasis will be on pit and pore formation, porous-structure/surface-property relations, work relevant to the formation of advanced materials and their characterization, and applications of these materials in different areas of science such as biomedicine, energy storage and conversion, optics and magnetism.

The symposium brings together scientists from various research fields such as material science, electrochemistry, physics, chemistry, engineering and biology.

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