(Eric Wachsman will be presenting Safe, High-Energy-Density, Solid-State Li Batteries at AiMES 2018 in Cancun, Mexico on October 1, 2018.)

Behind the wheel of a ’68 Dodge Charger, Eric Wachsman discovered his passion for clean energy technology. He was a teenage boy in high school, and the open road was calling out to him.

“I just lived for cars,” says Wachsman, who serves on the ECS board of directors. “I could not wait to get my first car.”

So when he hit the road in his $1,500 hot rod, loaded with a holley double pumper carburetor, headers. “You name it.” He was thrilled. “That thing was the fastest thing around.”

However, life on the road soon came to a screeching halt.

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Your all-inclusive reservation includes unlimited meals, drinks, taxes and gratuities.

Have you made your plans yet to join us at the upcoming AiMES 2018 meeting in Cancun from September 30–October 4?

Of course, the technical program is one of the most comprehensive in the fields of electrochemistry and solid state science, but you will also have many different options for how to enjoy your free time!

The meeting will be held at the beautiful Moon Palace Resort, a gigantic luxury resort located along Cancun’s Mayan Riviera and set amidst 55-acres of lush tropical foliage. Just minutes from the Cancun International Airport, it features a full-service spa, a 27-hole golf course designed by Jack Nicklaus, a larger-than-life pool, and numerous restaurants and dining options, all making for an unforgettable experience.

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Join us at AiMES 2018

Early bird registration for AiMES 2018 in Cancun, Mexico is now open! We are excited to invite you to the Americas International Meeting on Electrochemistry and Solid-State Science (AiMES 2018), a joint conference of the 234th ECS Meeting, the XXXIII Congreso de la Sociedad Mexicana de Electroquimica (SMEQ), and the 11th Meeting of the Mexico Section of ECS.

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Why attend?

As a must-attend event for scientists and engineers from across the globe, AiMES 2018 will introduce you to the latest research trends, and industry leaders, all of which will help you make major strides in your career. The unique blend of electrochemical and solid state science and technology at AiMES 2018 provides a forum to learn and exchange information on the latest scientific and technical developments in a variety of interdisciplinary areas. Look through the technical program to see a full list of the topics that will be covered.

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Deadline for Submitting Abstracts
March 30, 2018
Submit today!

Topic Close-up #11

Symposium E04: Electrodeposition of Reactive Metals and Alloys for Energy Storage

Symposium purpose is to bring together experts from the fields of electrodeposition and energy storage to discuss and learn about the science and technological issues in this fascinating topic which we share. Electrodeposition or plating of reactive compounds is common place in energy storage applications such as metal-air, lithium metal and next generation sodium, magnesium or calcium battery concepts. On the other hand, high quality coatings of reactive metals and alloys such as aluminum, magnesium, vanadium and zinc find applications in anti-corrosion coatings, microelectronics, fuel cells, electrolyzers, supercapacitors and sensors. We welcome all abstracts about novel deposition processes, electrolytes and additives, insights in kinetics, nucleation and growth phenomena, as well as on advanced applications in this field.

Confirmed Invited Speakers include Dr. Fanny Barde of Toyota Motor Europe, Dr. Debra R. Rolison of NRL, Prof. Craig B. Arnold from Princeton University, Prof. Takayuki Homma from Waseda University and Snehashis Choudhury, young investigator at Cornell University (group of prof. Lynden Archer).

Deadline for Submitting Abstracts
March 30, 2018
Submit today!

Topic Close-up #10

Symposium G02: Atomic Layer Deposition Applications 14

Symposium Focus: This symposium focuses on a variety of applications of ALD and other atomic layer-by-layer processing in semiconductor CMOS (e.g. high-k oxides and metals for memories like Flash and 3D NAND, MIM, MIS capacitors), photovoltaics, energy storage and conversion, catalysis, optics and photonics, smart coatings of nanoporous materials, MLD and hybrid ALD/MLD, fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory, new precursors and delivery systems, optical and photonic applications, productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition, spatial ALD, area-selective ALD, Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #9

Symposium G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8

Symposium Focus: This meeting is the 8th International ECS SiGe Symposium for the past 16 years (www.sigesymposium.com). It will provide a forum for people from industry, research institutions, and academics around the world to gather together in an unique and relaxed environment, reviewing and discussing materials and device related aspects of SiGe, Ge, and Related Compounds (Group IV incl. C and Sn alloys, and III/V on Si, as well as 2D materials). There are 10 areas of interests covering very broad spectrum from devices to fundamental material characterization, to stimulate information exchange and innovations, 1) Heterojunction Bipolar Transistors, 2) FET Technology, 3) Optoelectronics, 4) Epitaxy, 5) Emerging Applications, 6) Processing, 7) Strain Engineering, 8) Surfaces and Interfaces, 9) Related Compounds, 10) Metrology and Characterization.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #8

Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15

Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.

Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #7

Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Topic Close-up #6

Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.

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