Kohei Shima was born in Wakayama Prefecture, Japan. His academic career began at the University of Tokyo, where he received his BS and MS degrees in materials engineering in 2011 and 2013, respectively. During that time, his research focused on developing and characterizing new CVD/ALD-based Cu(Mn)/Co(W) interconnect systems for next-generation tiny Cu interconnects.
Currently, Shima is working toward a PhD in materials engineering at the University of Tokyo. His current research interests include process design and development to fabricate SiC/SiC ceramics matrix composites using chemical vapor infiltration (CVI). He has been conducting research to reveal the SiC-CVI surface reaction mechanism by utilizing trench-patterned structures. For this purpose, he has developed a new type of CVD test structure with ultra-high aspect-ratio microtrenches.
Shima is a member of the Japan Society of Applied Physics (JSAP) and the Society of Chemical Engineers, Japan (SCEJ).
Bruce Deal & Andy Grove Young Author Award winning paper: “Comparative Study on Cu-CVD Nucleation Using β-diketonato and Amidinato Precursors for Sub-10-nm-Thick Continuous Film Growth“
